309 Semiconductor jobs in the United States

Job Title: Semiconductor Technician

Job Description

This role serves as a liaison between the Lab and Laser safety room. Responsibilities include monitoring, documenting, and cleaning steel parts installed into semiconductor equipment from clients. The technician is also responsible for processing and testing parts and assemblies received from high-tech manufacturing customers.

Responsibilities

• Spend 30 minutes in the laser room monitoring, documenting, and cleaning steel parts.

• Process, test, and package customer parts and equipment in a critically controlled cleanroom environment.

• Read and follow written work instructions and procedures, ensuring each step is completed and documented.

• Perform tasks in a cleanroom while adhering to required cleanroom garments, PPE, and quality protocols.

• Support inventory management to maintain proper stocking levels.

• Ensure the work area, equipment, and tools are clean and properly maintained.

Essential Skills

• Chemical handling

• Cleanroom experience

• Mechanical inclination

• Mechanical aptitude

• Good documentation and computer skills (Word, ERP, Engineering Documentation for safety SOPs)

• Ability to articulate with engineering and operations teams both written and verbally

• 2+ years of experience with good tenure at each place

Additional Skills & Qualifications

• 3+ months working in a cleanroom environment

• 3+ months of mechanical assembly of parts, cleaning, and re-assembling semiconductor parts/tools

• 3+ months reading schematics or standard operating procedures (SOPs)

• Proven knowledge through references or education in writing and documentation using Word

• Must be comfortable working with chemicals

• 2+ years of experience working with computers on a weekly basis

Work Environment

The work environment includes lab and cleanroom settings, interacting with operations and engineering teams. The shift is a back-end day shift from 6 AM to 6 PM, Thursday through Saturday and every other Wednesday, with built-in overtime on four-day weeks. Employees must provide their own steel-toed shoes and long pants, while all other PPE is supplied. Punctuality and attention to detail are crucial.

Job Type & Location

This is a Contract to Hire position based out of Chandler, Arizona.

Pay and Benefits

The pay range for this position is $20.00 - $23.00/hr.

Eligibility requirements apply to some benefits and may depend on your job classification and length of employment. Benefits are subject to change and may be subject to specific elections, plan, or program terms. If eligible, the benefits available for this temporary role may include the following:

• Medical, dental & vision • Critical Illness, Accident, and Hospital • 401(k) Retirement Plan – Pre-tax and Roth post-tax contributions available • Life Insurance (Voluntary Life & AD&D for the employee and dependents) • Short and long-term disability • Health Spending Account (HSA) • Transportation benefits • Employee Assistance Program • Time Off/Leave (PTO, Vacation or Sick Leave)

Workplace Type

This is a fully onsite position in Chandler,AZ.

Application Deadline

This position is anticipated to close on Sep 5, 2025.

About Actalent

Actalent is a global leader in engineering and sciences services and talent solutions. We help visionary companies advance their engineering and science initiatives through access to specialized experts who drive scale, innovation and speed to market. With a network of almost 30,000 consultants and more than 4,500 clients across the U.S., Canada, Asia and Europe, Actalent serves many of the Fortune 500.

The company is an equal opportunity employer and will consider all applications without regard to race, sex, age, color, religion, national origin, veteran status, disability, sexual orientation, gender identity, genetic information or any characteristic protected by law.

If you would like to request a reasonable accommodation, such as the modification or adjustment of the job application process or interviewing due to a disability, please email (% ) for other accommodation options.

Job Title: Semiconductor Technician
Job Description
This role serves as a liaison between the Lab and Laser safety room. Responsibilities include monitoring, documenting, and cleaning steel parts installed into semiconductor equipment from clients. The technician is also responsible for processing and testing parts and assemblies received from high-tech manufacturing customers.
Responsibilities
+ Spend 30 minutes in the laser room monitoring, documenting, and cleaning steel parts.
+ Process, test, and package customer parts and equipment in a critically controlled cleanroom environment.
+ Read and follow written work instructions and procedures, ensuring each step is completed and documented.
+ Perform tasks in a cleanroom while adhering to required cleanroom garments, PPE, and quality protocols.
+ Support inventory management to maintain proper stocking levels.
+ Ensure the work area, equipment, and tools are clean and properly maintained.
Essential Skills
+ Chemical handling
+ Cleanroom experience
+ Mechanical inclination
+ Mechanical aptitude
+ Good documentation and computer skills (Word, ERP, Engineering Documentation for safety SOPs)
+ Ability to articulate with engineering and operations teams both written and verbally
+ 2+ years of experience with good tenure at each place
Additional Skills & Qualifications
+ 3+ months working in a cleanroom environment
+ 3+ months of mechanical assembly of parts, cleaning, and re-assembling semiconductor parts/tools
+ 3+ months reading schematics or standard operating procedures (SOPs)
+ Proven knowledge through references or education in writing and documentation using Word
+ Must be comfortable working with chemicals
+ 2+ years of experience working with computers on a weekly basis
Work Environment
The work environment includes lab and cleanroom settings, interacting with operations and engineering teams. The shift is a back-end day shift from 6 AM to 6 PM, Thursday through Saturday and every other Wednesday, with built-in overtime on four-day weeks. Employees must provide their own steel-toed shoes and long pants, while all other PPE is supplied. Punctuality and attention to detail are crucial.
Job Type & Location
This is a Contract to Hire position based out of Chandler, Arizona.
Pay and Benefits
The pay range for this position is $20.00 - $23.00/hr.
Eligibility requirements apply to some benefits and may depend on your job classification and length of employment. Benefits are subject to change and may be subject to specific elections, plan, or program terms. If eligible, the benefits available for this temporary role may include the following:
- Medical, dental & vision - Critical Illness, Accident, and Hospital - 401(k) Retirement Plan - Pre-tax and Roth post-tax contributions available - Life Insurance (Voluntary Life & AD&D for the employee and dependents) - Short and long-term disability - Health Spending Account (HSA) - Transportation benefits - Employee Assistance Program - Time Off/Leave (PTO, Vacation or Sick Leave)
Workplace Type
This is a fully onsite position in Chandler,AZ.
Application Deadline
This position is anticipated to close on Sep 5, 2025.
About Actalent
Actalent is a global leader in engineering and sciences services and talent solutions. We help visionary companies advance their engineering and science initiatives through access to specialized experts who drive scale, innovation and speed to market. With a network of almost 30,000 consultants and more than 4,500 clients across the U.S., Canada, Asia and Europe, Actalent serves many of the Fortune 500.
The company is an equal opportunity employer and will consider all applications without regard to race, sex, age, color, religion, national origin, veteran status, disability, sexual orientation, gender identity, genetic information or any characteristic protected by law.
If you would like to request a reasonable accommodation, such as the modification or adjustment of the job application process or interviewing due to a disability, please email (% ) for other accommodation options.

RELOCATION ASSISTANCE: Relocation assistance may be available
CLEARANCE TYPE: SCI
TRAVEL: Yes, 10% of the Time
**Description**
At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.
The Northrop Grumman Microelectronics Center (NGMC) of Northrop Grumman Mission Systems is seeking an exceptionally talented, motivated, and creative **Semiconductor** **Process Integration Engineer (Off-Centered 2nd Shift)** or **Principal Semiconductor Process Integration Engineer (Off-Centered 2nd Shift)** position located at our Linthicum, MD facility. Advanced Technology Lab (ATL) is located just outside of Baltimore, MD - where we design, manufacture, and test semiconductor products for internal and commercial production as well as emerging programs. We have over 21,000 square feet of Class 100 wafer fabrication cleanroom that supports variants of Si; SiGe; GaAs; SiC.
At Northrop Grumman's Advanced Technology Lab - VARIETY describes the work that our process integration team enjoys. The process integration team at ATL has the chance to work on both production and development programs, as well as troubleshooting and process improvements. Many people on our process integration team work on more than one product/program at once and have exposure to other products as well. The semiconductor process integration group is also an integral part of the foundry process, interfacing with multiple other foundry groups on a daily basis.
**Roles and Responsibilities:**
The **Semiconductor / Principal Semiconductor Process Integration Engineer (Off-Centered 2nd shift)** will be focusing on Superconducting Electronics with opportunities to connect with multiple advanced technologies. The Process Integration Engineer must have an understanding of basic semiconductor processing, especially in Back End of Line (BEOL) process integration with knowledge in yield improvement and defect reduction. This candidate must have an aptitude for hands-on laboratory and experimental work. Excellent verbal and written communication skills are required. The successful candidate may also support program execution for programs within the Micro Systems Technologies portfolio.
Join us for the chance to work with an amazing, experienced, and talented team. We are expanding with new work on many development and production programs.
This requisition may be filled as either **Semiconductor Process Integration Engineer** or **Principal Semiconductor Process Integration Engineer.**
**Basic Qualifications for Semiconductor Process Integration Engineer:**
+ Bachelor's Degree in Engineering, Microelectronics, Material Science, Chemistry, Physics or closely related technical major with 2+ years of relevant experience; Master's Degree in Engineering, Microelectronics, Material Science, Chemistry, Physics or closely related technical major with 0+ years of relevant experience.
+ Must have an understanding of basic semiconductor processing, especially in Back End of Line (BEOL) process integration.
+ Must have an aptitude for hands-on laboratory and experimental work.
+ Must work Off-Center 2nd Shift - Wednesday to Saturday 2:00pm - 12:30am.
+ Experience interfacing with multiple shifts in a 24/7 environment.
+ U.S. Citizenship required.
+ The ability to obtain and maintain a DoD Top Secret w/SCI clearance is required.
**Basic Qualifications for Principal Semiconductor Process Integration Engineer:**
+ Bachelor's Degree in Engineering, Microelectronics, Material Science, Chemistry, Physics or closely related technical major with 5+ years of relevant experience; Master's Degree in Engineering, Microelectronics, Material Science, Chemistry, Physics or closely related technical major with 3+ years of relevant experience; PhD. in Engineering, Microelectronics, Material Science, Chemistry, Physics or closely related technical major with 1+ years of relevant experience.
+ Must have an understanding of basic semiconductor processing, especially in Back End of Line (BEOL) process integration.
+ Must have an aptitude for hands-on laboratory and experimental work.
+ Must work Off-Center 2nd Shift - Wednesday to Saturday 2:00pm - 12:30am.
+ Experience interfacing with multiple shifts in a 24/7 environment.
+ U.S. Citizenship required.
+ The ability to obtain and maintain a DoD Top Secret w/SCI clearance is required.
**Preferred Qualifications:**
+ Active TS/ SCI clearance
+ Semiconductor processing, analog and microwave electronic circuits experience
+ FEOL, BEOL, Far-BEOL semiconductor fabrication experience
+ Superconducting electronics experience
+ DC test analysis, PCM analysis, and production engineering experience
+ Knowledge of yield improvement and defect reduction utilizing automated defect inspection tools and software.
+ Experience with DOEs, JMP, and statistical analysis
#NGATL
#NGMCFab
Salary Range: $85,400.00 - $28,000.00Salary Range 2: 105,400.00 - 158,000.00
The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.
Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.
The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.
Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.

We are seeking a dynamic and experienced Semiconductor Quality Director to lead our quality assurance and control initiatives. This pivotal role will involve developing and implementing quality strategies that align with our organizational goals, ensuring compliance with industry standards, and fostering a culture of continuous improvement throughout the manufacturing process.

Ascentec Engineering is a leader in innovative high-tech contact manufacturing and precision machining. We specialize in delivering high-quality solutions across various industries, including aerospace, semiconductor, and high-tech OEM manufactures. Our commitment to excellence and continuous improvement drives our success and the satisfaction of our clients.

We believe in investing in our people and fostering a culture of innovation and excellence. We offer competitive compensation, comprehensive benefits, and opportunities for professional growth and development. Join us in shaping the future of precision machining and contract manufacturing!

This position is onsite (not remote/not hybrid) at our Tualatin headquarters and is not eligible for Visa sponsorship.

Requirements

KEY RESPONSIBILITIES:

• Quality Strategy Development: Advance and improve an existing comprehensive quality strategy and QMS that enhances product reliability, meets customer expectations, and aligns with industry standards (ISO, AS9100, etc.).

• Leadership & Team Management: Lead and mentor the quality assurance team for a global network of manufacturing locations, promoting professional development and fostering a collaborative environment.

• Quality Assurance & Control: Oversee all quality assurance processes, including inspection, testing, and validation procedures, ensuring products meet specifications and regulatory requirements.

• Continuous Improvement: Drive initiatives to enhance manufacturing processes, reduce defects, and increase efficiency using methodologies such as Six Sigma, Lean, 8D and Root Cause Analysis.

• Supplier Quality Management: Collaborate with suppliers to establish quality requirements and ensure compliance, conducting regular audits and assessments.

• Regulatory Compliance: Stay current with industry regulations and standards, ensuring that all manufacturing processes and products adhere to legal and safety requirements.

• Customer Engagement: Act as the primary point of contact for quality-related customer inquiries and issues, ensuring prompt resolution and maintaining strong customer relationships.

• Data Analysis & Reporting: Utilize data analytics to track quality metrics, identify trends, and provide regular reports to senior management on quality performance and improvement initiatives.

QUALIFICATIONS:

• Bachelor's degree in Engineering, Quality Management, or a related field; a Master's degree or relevant certification (CQE, CQM, etc.) is a plus.

• 10+ years of experience in quality management within a high-tech manufacturing or precision machining environment.

• Proven experience in leading quality assurance teams and managing cross-functional projects.

• Strong knowledge of quality standards, methodologies, and tools (ISO 9001, AS9100, Six Sigma, Lean).

• Excellent analytical skills with the ability to interpret complex data and provide actionable insights.

• Strong communication, presentation and interpersonal skills, with the ability to influence and collaborate across all levels of the organization.

• Demonstrated ability to manage multiple projects and priorities in a fast-paced environment.

COMPENSATION / BENEFITS:

- Salary: $125,000 to $50,000 annual salary, plus eligibility for 20% annual discretionary management bonus.

- Opportunities for professional development and career advancement.

- Paid time off/Paid holidays

- Medical / Dental / Vision Coverage

- 401K with matching funds

OTHER REQUIREMENTS:

Applicant must be able to pass a drug screen and criminal background check prior to employment.

ITAR REQUIREMENTS: To conform to U.S. Government space technology export regulations, including the International Traffic in Arms Regulations (ITAR) you must be a U.S. citizen, lawful permanent resident of the U.S., protected individual as defined by 8 U.S.C. 1324b(a)(3), or eligible to obtain the required authorizations from the U.S. Department of State.

Ascentec Engineering is an Equal Opportunity Employer; employment with Ascentec Engineering is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.

Salary Description

125,000 to 150,000

We are seeking two talented and motivated wafer fab process engineers with a focus on advanced semiconductor packaging to join our cutting-edge fabrication team. In this role, you'll work on the forefront of 3D chip stacking and flip-chip hybridization, building integrated devices that form the heart of next-generation electronic systems.

This is your opportunity to work hands-on with state-of-the-art hybridization equipment, contributing directly to breakthrough innovations in device performance and packaging efficiency.

Location: Shoreview, MN

Wage: $33 - $7/hr ( 68,500 - 97,800/year), depending on experience

Hours: 1st shift | Monday - Friday | 7:30 am - 3:30 pm

Benefits of the semiconductor advanced packaging engineer:

• Be part of a dynamic and innovative engineering team
• Opportunity to grow into a technical leadership role
• Work directly on advanced optical semiconductor technologies
• Career development in a forward-thinking environment
• Health, dental, vision, life, and disability insurance
• 401(k)
• Scheduled raise/salary review
• Company parties
• Stable shop with long term customers

Duties of the semiconductor advanced packaging engineer:

• Operate chip stacking and hybridization equipment (FC-150, FC-300) for flip-chip 3D processes
• Run and support fab tools like evaporation, sputtering, or RIE as needed
• Perform process QC to maintain high yield and product quality
• Document, troubleshoot, and improve processes
• Work with engineering teams to scale operations and build future team capability

Requirements of the semiconductor advanced packaging engineer:

• Bachelor's or Master's in Physics or Engineering (required)
• Interest in advanced packaging and hybridization
• Experience with deposition or etch equipment (preferred)
• Flip-chip or 3D packaging experience a plus

Additional information:

Apply today! To learn more about this semiconductor advanced packaging engineer position, contact Matt at .

EOE: Twin City Staffing is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or veteran status.

Job Purpose:

We are seeking a hands-on Semiconductor Packaging Engineer to work for a High-Tech Semiconductor Manufacturer in the Tucson, Area. The Semiconductor Packaging Engineer will ensure stable, robust, repeatable, sustainable and high-yielding manufacturing processes and products are achieved, monitored and maintained and will help to implement a new MES system. Process development and optimize physical packaging. Developing and improving manufacturing processes for packaging, including wafer-level and chip-level assembly, and bonding.

Responsibilities include development, continuous improvement, and sustaining processes all in close partnership with Device and Integration Engineering as well as design teams. You will be expected to clearly communicate goals, roles, and responsibilities, engage and motivate engineering talent, define and set deliverables, plan resources, and achieve desired results. You will be expected to contribute technically, maintain an optimistic, can-do approach, and present status to executive level management. Excellent judgment, expertise in semiconductor processing, and leadership are essential to success in this role. The position reports to the Process Engineering Manager. Will monitor and control of the process. Improve the process or introduce new process and tools to improve yield, capacity and quality. Work with engineering team to develop new products. Work with engineering team to transfer new products or new process to production and will help to implement a new MES system.

Position responsibilities include daily oversight of manufacturing operations, continuous improvement of operational processes including scheduling and executing production for Back End Assembly Process. Conducts studies in operations to optimize workflow and space utilization. Ensures facility efficiency and workplace safety.

Responsibilities:

* Manufacturing monitoring and improvements with SPC.
* Creating weekly yield reports using statistical tools.
* Creating and maintaining work standards using work measurement, and dynamic and static capacity and cost simulation models.
* Workflow optimization through creating and implementing in-process kanbans models.
* Working with materials manager for supply chain optimization and inventory minimization through creating and implementing raw material kanbans.
* Design of Experiments (DOE) and data analysis to support engineering efforts to improve product design and manufacturability.
* Performance measurement and analysis to monitor and improve manufacturing.
* Applying various statistical methods to improve reproducibility and manufacturability through Failure Mode Effect Analysis (FMEA) , Control Plan and Gage R&R studies.
* Data analysis and improvements to manufacturing capabilities.
* Work with information technology department to improve database structures and collection methods to improve manufacturing.
* Cost and net worth analysis to evaluate capital expenditures for expansion scenarios.
* Maximize space utilization through layout evaluation, design, and improvements, using design software such as AutoCAD, Draftsight.

Duties:

* Develop and maintain positive working relationships with applicable departments and suppliers to evaluate potential new processes and materials to improve cost, yield, reliability and quality.
* Drive identification and implementation of process improvements to increase yield and reduce operating costs.
* Identify new hardware requirements to meet the developing process/customer needs. Ensure these requirements are addressed appropriately with regard to specifications, budget constraints, supplier identification and thorough evaluation.
* Develop, modify and/or continuously improve manufacturing process and procedures to enable higher productivity, reduced scrap, and improved quality.

Skills/Qualifications:

Must have a B.S. or M.S. Electrical or Mechanical Engineering or a related field.

Must have knowledge of process Assembly of semiconductor lasers. Communication and managing skills are required.

Clean room manufacturing environment, experience working in cleanrooms and labs.

Exposure to medium to long term projects.

3+ years of experience within the semiconductor industry (die bonding, oven, wire bonding, lead frame design, SMT, reflowing, among other processes).

New Product Introduction. Strong verbal, written, presentation, analytical and interpersonal skills.

Leadership capabilities to drive and deliver results through motivating cross-cultural teams.

Highly proficient in Excel, Word, Powerpoint and statistical software.

Strong analytical and problem solving ability. Appreciation of both practical and theoretical methodologies.

Experienced in equipment selection, commissioning and process set-up.

Knowledge of troubleshooting guides, working documentation, safety.

Knowledge of quality systems and reliability assessment.

Strong SPC and DOE skill set and experience.

Experience with Lean and 5S programs. Experience with Six Sigma.

Demonstrated success in project management.

Detailed working knowledge of semiconductor wafer fabrication processes, including wet and dry etching, thin films, moderate scale photolithography.

Proven track record in program management and technical team leadership.

Self-motivated with the ability to work both independently and in a team environment

This position is located in the United States and will require use of information which is subject to the International Traffic in Arms Regulations (ITAR). As such, all applicants must be U.S. persons within the meaning of ITAR. ITAR defines a U.S. person as a U.S. Citizen, U.S. Permanent Resident (i.e. 'Green Card Holder'), Political Asylee, or Refugee.

Leonardo is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability status, protected veteran status, or any other characteristic protected by law.

(NOTE: The above statements are intended to describe the general nature and level of work being performed by people assigned to this classification. They are not to be construed as an exhaustive list of all responsibilities, duties, and skills required of personnel so classified. All personnel may be required to perform duties outside of their normal responsibilities from time to time, as needed.)

Here are the hiring process steps and what you can expect from us:

Step 1: Application Review:

Upon submitting your application, it is made available to the recruitment team to review and ensure you meet the basic qualifications.

Step 2: Interview:

If you have been identified to move forward in the process, you may be invited to participate in a one-on-one or panel interview. The interview format can be a phone call, in-person, or virtual meeting.

Step 3: Offer:

If you reach this stage of the interview process, congratulations! You will be provided an offer to join the Leonardo Electronics US Inc. team. The offer will include details about your salary, benefits package and start date.